Huawei Technologies is set to unveil a technological breakthrough that could reduce China’s reliance on high-bandwidth memory (HBM) chips for running artificial intelligence reasoning models, according to state-run Securities Times.
The announcement will take place in collaboration with China UnionPay at the 2025 Financial AI Reasoning Application Landing and Development Forum in Shanghai on Tuesday, according to the report on Sunday. The event aims to promote AI reasoning models and applications in the financial sector.
Huawei did not immediately respond to a request for comment on Monday.
If confirmed, the development would represent the latest step by the US-sanctioned tech giant to establish a self-sufficient AI hardware ecosystem in China.
The top suppliers of HBM semiconductors, often integrated into AI chipsets, are US companies Micron Technology and Advanced Micro Devices, as well as South Korean firms Samsung Electronics and SK Hynix.
