Mainland China is on track to surpass Taiwan in semiconductor foundry capacity by 2030, according to a report from Yole Group, underscoring Beijing’s progress in its push for chip self-sufficiency amid ongoing US tech restrictions.
The mainland’s share of global foundry capacity is projected to reach 30 per cent by the end of the decade, up from 21 per cent in 2024, the French market research firm said. Taiwan is currently the market leader with a 23 per cent share last year, while mainland China is already ahead of South Korea at 19 per cent, Japan at 13 per cent and the US at 10 per cent.
Domestic fabs are set to play a bigger role over the next few years, according to the report, which said local chipmakers accounted for 15 per cent of foundry capacity in 2024. That share will be “significantly more” by 2030, the report said.
